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Apple iPhone 16 Plus Pro Max e A18/A18 pro BGA Reballing Stencil
Condition: 100% Brand New
Type: BGA Reballing Stencil / Tin Soldering Template
Compatibility: Apple iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max (A18 / A18 Pro Chip)
Material: High-quality stainless steel for durability and heat resistance
Function: Used for precise soldering, chip alignment, and reballing A18 / A18 Pro ICs
Design: Laser-cut holes for accurate solder ball placement and professional-grade results
Usage: Ideal for micro-soldering, IC repair, and logic board maintenance
1 × BGA Reballing Stencil Tin Soldering Template for iPhone 16 Series (A18 / A18 Pro)
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